Lee Smith – Lead Software Engineer, Mettler-Toledo

  • Lee Smith, Lead Software Engineer at Mettler-Toledo for 7 years, is Co-Chairman of the OMAC Packaging Workgroup. Having represented Mettler-Toledo for the past 5 years at OMAC events, Lee is now involved in leading the activities which will shape the future direction of OMAC’s packaging initiatives.

    Presentation Title:

    Integrating product inspection equipment using PackML/OPC UA

    Presentation Synopsis:

    This seminar gives a high level overview of PackML, explaining how it provides standards-based monitoring, control and integration capabilities for production machinery. It will provide a practical example of implementing PackML across a range of product inspection solutions, including checkweighing, metal detection, vision and x-ray inspection systems.

  • Sponsor

    Media Partners